BN44 00438A, BN44 00468A – SMPS schematic – Samsung LN32D403E2G, LN26D450 LED LCD TV
Samsung
LE32D400E1W, Samsung LN26D450G1DXZA, Samsung LN32D450G1DXZA LED LCD TV power
board circuit diagram: Used
ICs - SEM3040, STRW6052S, SEM2106
Attaching SMDs
When
soldering the SMD terminals, do not touch them directly with the soldering
iron. The soldering should be done as quickly as possible; care must be taken
to avoid damage to the terminals of the SMDs themselves.
* Keep the SMD's body in contact with the printed board when soldering.
* The soldering iron to be used (approx. 30 W ) should preferably be equipped with a thermal control (soldering temperature: 225 to 250 C).
* Soldering should not be done outside the solder land.
* Soldering flux (of rosin) may be used, but should not be acidic.
* After soldering, let the SMD cool down gradually at room temperature.
* The quantity of solder must be proportional to the size of the solder land. If the quantity is too great, the SMD might crack or the solder lands might be torn loose from the printed board.
* Keep the SMD's body in contact with the printed board when soldering.
* The soldering iron to be used (approx. 30 W ) should preferably be equipped with a thermal control (soldering temperature: 225 to 250 C).
* Soldering should not be done outside the solder land.
* Soldering flux (of rosin) may be used, but should not be acidic.
* After soldering, let the SMD cool down gradually at room temperature.
* The quantity of solder must be proportional to the size of the solder land. If the quantity is too great, the SMD might crack or the solder lands might be torn loose from the printed board.
Removal
of SMDs
* Heat the solder (for 2-3 seconds) at each terminal of the chip. By means of litz wire and a slight horizontal force, small components can be removed with the soldering iron.
They can also be removed with a solder sucker
* While
holding the SMD with a pair of tweezers, take it off gently using the soldering
iron's heat applied to each terminal..* Heat the solder (for 2-3 seconds) at each terminal of the chip. By means of litz wire and a slight horizontal force, small components can be removed with the soldering iron.
They can also be removed with a solder sucker
* Remove the excess solder on the solder lands
by means of litz wire or a solder sucker..
While holding the SMD with a pair of tweezers, take it off gently using the soldering iron's heat applied to each terminal..
* Remove the excess solder on the solder lands by means of litz wire or a solder sucker
While holding the SMD with a pair of tweezers, take it off gently using the soldering iron's heat applied to each terminal..
* Remove the excess solder on the solder lands by means of litz wire or a solder sucker
LN32D400, LN26D450 Power board [SMPS] and schematic
Click on the schematic to magnify